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Applied Materials, Inc., the global leader in providing manufacturing solutions for the semiconductor, flat panel display and solar photovoltaic industries, and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR), officially opened the Centre of Excellence in Advanced Packaging at Singapore's Science Park II on 07 March 2012. Singapore's Minister for Trade and Industry, Mr. Lim Hng Kiang, presided at the opening ceremony. The Centre will be the most advanced lab of its kind dedicated to wafer level packaging and will combine Applied Materials' leading-edge equipment and process technology with IME's leading research capability in 3D chip packaging. The Centre positions Singapore as a global leader in semiconductor R&D and is expected to help accelerate the development and adoption of 3D packaging technology globally.